铁氟龙, 氟橡胶, 铁氟龙FEP, PVDF法国阿科玛9000HD, ETFE日本旭硝子C-88AX, PFA美国杜邦340, PA66/F/PTFE美国液氮RFL-403, PA66/PTFE美国液氮RL-4040, POM/PTFE基础创新塑料KL004
| POLYFLON™ M-111 | |||
| Polytetrafluoroethylene | |||
| Product Description | |||
| Daikin PTFE (polytetrafluoroethylene) molding powders are excellent, fine cut resins, well suited for a variety of demanding chemical, mechanical, electrical and non-stick surface applications. These PTFE resins are fully fluorinated and have the best thermal, electrical, and chemical properties of all fluoropolymers with a continuous service rating of 500°F (260°C). Daikin PTFE molding powders are available in homopolymer and modified fine cut grades. | |||
| Daikin PTFE molding powders can be used continuously at temperatures up to 260°C (500°F) and for short periods of time at higher temperatures. They also possess excellent low temperature strength. | |||
| Daikin PTFE molding powders are completely inert to attack by all chemicals except hightemperature, high-pressure elemental fluorine gas, molten alkaline metals and chlorine trifluoride. | |||
| The non-polar molecular structure makes Daikin PTFE molding powders ideal for use as high-frequency insulating material. The dielectric constant and dissipation factor are uniformly low over a wide frequency range. | |||
| Under ordinary conditions of use, Daikin PTFE molding powders possess the lowest coefficient of friction of any solid material. Also, the non-stick properties of these products prevent most materials from adhering to them. | |||
| Chemical/Mechanical—Packings, gaskets, diaphragms, bellows, corrosion-resistant linings, piping components, pump parts, O-rings, V-rings, bushings, slide bearings, etc. | |||
| Electrical/Other—Insulating skived tape, insulating sleeves, terminals, connectors, sockets, spacers, electronic parts, laboratory equipment, etc. | |||
| General | |||
| Additive | Unspecified Additive | ||
| Features | Good Chemical Resistance | High Viscosity | Non-Stick |
| Good Creep Resistance | Low Friction | Weldable | |
| High Molecular Weight | Low Temperature Strength | ||
| Uses | Bearings | Gaskets | Piping |
| Bushings | Insulation Shield | Pump Parts | |
| Connectors | Labware | Sheet | |
| Diaphragms | Liners | Tape | |
| Electrical Parts | Packaging | ||
| Agency Ratings | FDA 21 CFR 177.1550 | ||
| Forms | Powder | ||
| Processing Method | Compression Molding | Sintering | |
| Physical | Nominal Value | Unit | Test Method |
| Specific Gravity | 2.17 | g/cm³ | ASTM D4894 |
| Apparent Density | 0.36 | g/cm³ | ASTM D4894 |
| Molding Shrinkage - Flow | 4.4 | % | Internal Method |
| Mechanical | Nominal Value | Unit | Test Method |
| Tensile Strength (Yield, 1.50 mm) | 40.0 | MPa | ASTM D4894 |
| Tensile Elongation (Break, 1.50 mm) | 500 | % | ASTM D4894 |
| Compressive Strength | ASTM D695 | ||
| 0% Strain 2 | 8.70 | MPa | |
| 1% Strain 3 | 5.90 | MPa | |
| 25% Strain 3 | 28.6 | MPa | |
| Deformation Under Load | ASTM D621 | ||
| 25°C, 14 MPa | 10.6 | % | |
| 100°C, 14 MPa | 21.7 | % | |
| 200°C, 6.9 MPa | 14.9 | % | |
| Elastomers | Nominal Value | Unit | Test Method |
| Compression Set | ASTM D621 | ||
| 25°C 4 | 3.0 | % | |
| 100°C 4 | 7.4 | % | |
| 200°C 5 | 4.1 | % | |
| Thermal | Nominal Value | Unit | Test Method |
| Continuous Use Temperature | 260 | °C | |
| Melting Temperature | 324 | °C | DSC |
| Electrical | Nominal Value | Unit | Test Method |
| Surface Resistivity | > 1.0E+15 | ohms | ASTM D257 |
| Volume Resistivity | > 1.0E+18 | ohms·cm | ASTM D257 |
| Dielectric Strength | 140 | kV/mm | |
| Dielectric Constant (1 kHz) | < 2.10 | ASTM D150 | |
| Dissipation Factor (1 kHz) | < 1.0E-4 | ASTM D150 | |
| Additional Information | Nominal Value | Test Method | |
| MIT Flexural Life | 3.00E+6 | ASTM D2178 | |
| Stretching Void Index | 62.0 | ASTM D4895 |
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